The $840 million project is part of the Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act and is sponsored by the Defense Advanced Research Project Agency (DARPA).
Under the agreement, TIE, which is based at the University of Texas at Austin, will establish a national fabrication facility for R&D and prototyping to enable the DOD to create higher performance, lower power, light weight and compact defense systems. Such technology could apply to radar, satellite imaging, unmanned aerial vehicles or other systems.
